Thermal materials
Polycrystalline CVD diamond is used in extreme thermal conductivity applications including telecommunications and laser diodes.
The Element Six Diafilm range of polycrystalline CVD (chemical vapour deposition) products stands out as a solution for management of thermal problems and an enabler of innovation.
It has supreme thermal conductivity, low coefficient of thermal expansion and high electrical resistivity, which make it the material of choice for critical thermal management applications.
Our range of thermal Diafilm materials includes:
Diafilm TM200* – With a thermal conductivity of more than 2000 W/m.K, this material is designed for the most challenging high-end thermal management problems.
Diafilm TM180* – With a thermal conductivity of more than 1800 W/m.K, this material is designed for challenging thermal management applications.
Diafilm TM150* – With a thermal conductivity of more than 1500 W/m.K, TM150 offers the best cost/performance ratio for a wide range of thermal management applications.
Diafilm TM100* – With heat spreading capabilities more than 2.5 times higher than copper (Tc>1000 W/mK), this is a low cost solution for less critical applications.
(Bulk resistivity (Rv) > 1012 W cm, Surface resistivity (Rs) > 1010 W)
These materials are available in a wide range of finishes and thickness, and can be supplied cut to a customer specific geometry.