- Knowledge Base
- About us
- Contact Us
Synthetic Diamond Market Leader Expands Portfolio to Offer Customers More Diamond Thermal Management Options
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (BOOTH #530), SAN DIEGO (Oct. 14, 2014)—Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130. DIAFILM TM130 has a thermal conductivity in excess of 1300 W/mK and is available in both metallized and un-metallized wafers form. Similar to Element Six’s material grades in its DIAFILM TM range, TM130 offers full isotropic heat spreading in both planar and through plane directions. Enhancing its already extensive portfolio to offer customers more options to address unique thermal management needs, Element Six now provides a total of five material grades spanning five levels of performance ranging from 1000 W/mK to 2000 W/mK.
“CVD diamond is the most thermally conductive material at room temperature, far surpassing the thermal conductivity of copper. With this new offering, we’re continuing to build our extensive portfolio of thermal grade materials to meet the needs of those in the microelectronics and electronics packaging industry,” said Director of Element Six Technologies, Adrian Wilson. “Recognizing a ‘one-size fits all’ approach is not effective, we’re committed to providing a full range of options and specifications to effectively address thermal management challenges, including specific requirements for surface flatness, low roughness and metallization.”
CVD diamond is uniquely suited for advanced thermal management in applications such as advanced packaging, due to its exceptional combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. In this role, CVD diamond enables system size reductions, improved reliability and the opportunity to design higher power systems within an existing module footprint.
With a focus on customizability, Element Six’s solid thermal products are available up to three millimeters thick and in diameters up to 140 millimeters that can be laser cut to any required size. Furthermore, metallization solutions enable die bonding with low thermal barrier resistance, consistent with industry standard soldering and brazing.
At the IMAPS 47th International Symposium on Microelectronics, Element Six will present on “Advanced Thermal Dissipation in GaN-on-Diamond Transistors,” developed in conjunction with the University of Notre Dame, on Wednesday, Oct. 15 at 8 a.m. PT. This presentation will discuss the thermal barriers that stand in the way of achieving the intrinsic performance potential of gallium nitride (GaN) semiconductors. In reviewing challenges, the presentation will share details about a recent solution which replaces GaN’s entire host substrate—such as silicon (Si) or silicon carbide (SiC)—with a synthetic diamond substrate, resulting in a more than 40 percent reduction of peak device temperature.
If you are interested in learning more about Element Six’s advanced thermal management materials, please visit www.e6.com/thermal or stop-by the company’s booth (#530) at the International Symposium on Microelectronics.
Press interested in speaking with an Element Six spokesperson can contact firstname.lastname@example.org.
TM130 added to the family of Element Six CVD diamond heat spreaders, which significantly thermally outperform traditionally used materials such as copper.