THERMAL MANAGEMENT
The performance requirements of today’s semiconductor devices and their manufacturing tools require advanced solutions to manage heat fluxes beyond the capabilities of conventional materials.
CVD diamond heat spreaders and optical windows eliminate heat flux bottlenecks in high power devices, from GaN RF power amplifiers to chiplet-based GPUs and AI accelerators with HBM memory, while in conjunction optimising wafer fabrication and inspection tools. Discover WSC™ wafer single crystal synthetic diamond solutions for improved system performance and device life and explore diamond baseplates and thermal coins for GPU chiplets and AI accelerator modules.
Access our dedicated WSC™ brochure to learn more.