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Thermal Management

CVD DIAMOND FOR HIGHER POWER DENSITY

Element Six’s CVD diamond heat spreaders provide enhanced thermal management capabilities, enabling greater system performance, stability, and device life. Run higher power levels or faster processes without increasing operating temperatures.

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The limitations of conventional thermal management solutions can put a tight bottleneck on devices and components. This forces system designers in the semiconductor, aerospace, telecommunications, and defence industries to compromise between size, performance and reliability.

Chemical Vapour Deposition (CVD) diamond heat spreaders can help you reduce thermal management bottlenecks and achieve lower operating temperatures, improved performance and extended system life in a range of electronics applications.

Element Six has the in-house expertise, end-to-end development capabilities, and scalable resources to create CVD diamond solutions that meet your exact thermal requirements.

When you collaborate with us, you gain access to a CS Industry award-winning thermal solution manufacturer that can go beyond single components to understand and solve thermal management challenges across your entire system.

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Find out the specific details of the performance of our supermaterials and how they apply to your industry:

Discover our thermal grades

Buy samples of our thermal material grades on our CVD webstore.

See our thermal management solutions at work

STEP-CHANGE THERMAL MANAGEMENT OF RF DEVICES USING CVD DIAMOND

Thermal conductivity between 1000 and 2200  W/(mK) can be supplied according to your needs.

For power amplifiers, CVD diamond heat spreaders enable:

  • Higher power operation for a given maximum operating temperature
  • Reduced peak temperatures for a given power
  • Thermal resistance drop by 30% when using CVD diamond in an RF package  |  Learn more through our case studies

Passive radio frequency (RF) resistors using CVD diamond substrates can operate above 20 GHz, six times higher frequencies than AlN at the same power level, before parasitic effects lead to signal distortion.

Semiconductor

METALLISED CVD DIAMOND FOR DIE BONDING

Our expertise in metallised CVD diamond provides you with a functional material you can use in die bonding, with low thermal barrier resistance, delivering strong and reliable thermal contact.

E6’s specialised team of application engineers and processing technologists will help you to design the right component for your application. Using state-of-the-art computer simulations, the ultimate performance of a component can be accurately predicted.

Applications include AI ASICs and GPUs, RF packaging and laser diodes.

Read our case study to find out more.

CVD heat spreader

WSC™ - WAFER SINGLE CRYSTAL SYNTHETIC DIAMOND FOR DIRECT BONDING

Working in collaboration with Orbray,  we have pioneered a new range of single crystal synthetic diamond wafers with the highest thermal conductivity, that can be used as advanced heat spreaders, providing greater device performance, increased device life, and reduced cooling requirements.

The WSC™ range is suitable for direct bonding at wafer level, for thermal management of advanced power and RF electronics.

Find out more about WSC™ and contact our team today.

Oil and Gas Thermal Computer

DISCOVER CU-DIAMOND

A high-performance copper-diamond composite for demanding thermal management applications.
 
Produced through a unique manufacturing process, Cu-Diamond has a thermal conductivity more than double the value of copper and offers a much closer CTE match to common semiconductors. 

Cu-Diamond is an ideal choice of heat spreader for a range of high-power density semiconductor device applications, including:

  • AI chips for high performance computing in data centres
  • RF power amplifiers for wireless communications
  • power modules for reliable power conversion
  • semiconductor lasers

Read more or contact us today to find out more.

Cu-Diamond materials